Destructive Physical Analysis (DPA) 

DPA is the acronym for Destructive Physical Analysis, which is the disassembly, testing and inspection of a semiconductor, microcircuit or passive device to determine how well it conforms to its design and process requirements. DPA is often used as a subset of a broader set of test requirements.

DPA testing facilitates the early detection of defective or non-conforming material, which lowers the cost of assembly and rework, thus reducing field failure rates in mission critical applications. DPA is also used as an aid in the detection of counterfeit devices. And when used as part of a device qualification process, DPA testing can empower our customers to identify and qualify new or alternative devices to ensure the fulfillment of delivery commitments when material shortages or device quality issues arise.

Our wide breadth of DPA services includes:

External Visual Insepection Lead Fatigue / Terminal Strength Chemical and Plasma Etching Cross Section Analysis Internal Visual Inspection Residual Gas Analysis (RGA) Constructional Analysis Digital Microscopy Physical Dimension Analysis Bond Strength Testing Scanning Electron Microscopy (SEM) Electron Dispersive X-RAY Spectroscopy (EDS)

Compliant with Industry Standards

• MIL STD-1580B
• MIL STD-883F (Microcircuits and Hybrids)
• MIL STD-750D (Semiconductors)
• SSQ-25000 and SSQ-25001 (Space Station Program)

Sypris Test & Measurement also brings more than 40 years of DPA experience to everything we do.

Contact a Sypris Test & Measurement representative today fod DPA by calling our toll-free hotline: 800-839-4959. Or, view contact information for our regional sales managers and laboratories.